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ISRN Mechanical EngineeringVolume 2011 2011, Article ID 825073, 7 pages

Research ArticleDepartment of Mechanical Engineering, Bangladesh University of Engineering and Technology, Dhaka1000, Bangladesh

Received 27 January 2011; Accepted 20 March 2011

Academic Editors: W.-H. Chen and J. Clayton

Copyright © 2011 Aloke Kumar Mozumder et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.


In spite of wide application of heat pipe in microelectronics cooling system, a complete understanding of heat pipe mechanism has not yet been completed. An experimental investigation of heat transfer performance of a heat pipe for dry condition and with three different liquids as acetone, methanol, and water having four fill ratios, for each liquid has been conducted in the present study. The heat pipe was 5 mm in diameter and 150 mm long with a thermal capacity of 10 W. The evaporator and condenser-s temperatures were measured with varying input power to estimate the heat transfer coefficient. This study reveals that the dominating parameters for the heat transfer coefficient are evaporator surface temperature, saturated boiling temperature of working fluid, latent heat of vaporization, and fill ratio. The investigation also shows that 85% fill ratio can be regarded as an optimum value for a heat pipe. A new correlation for the heat transfer coefficient has been proposed here which fairly agrees with the experimental results.

Author: Aloke Kumar Mozumder, Mohammed Shafiul Hasib Chowdhury, and Abul Fahad Akon



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