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Abstract : Recent advances in Compact Thermal Models CTM have led to the emergence of a new concept allowing models to be created at any desired order of accuracy. In this paper, the concept will first be generalized to 3D parallelepiped boxes with both surface and-or volumetric heating. The second achievement is an adequate handling of heat transfer through side walls based on an analytic approach using an adequate series expansion. Second, a methodology will be proposed in order to apply the proposed model to complicated real life geometries, including in particular packaging structures. Last the case of Robin type boundary conditions will be treated

Keywords : Compact Thermal Models 3D heat transfer coefficient packaging





Author: M.-N. Sabry -

Source: https://hal.archives-ouvertes.fr/



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