Thermal Transient Multisource Simulation Using Cubic Spline Interpolation of Zth Functions - Condensed Matter > Materials ScienceReport as inadecuate




Thermal Transient Multisource Simulation Using Cubic Spline Interpolation of Zth Functions - Condensed Matter > Materials Science - Download this document for free, or read online. Document in PDF available to download.

Abstract: This paper presents a very straightforward method to compute the transientthermal response to arbitrary power dissipation profiles in electronic deviceswith multiple heat sources. Using cubic spline interpolation of simulated ormeasured unit power step response curves Zth-functions, additional errors dueto model reduction can be avoided. No effort has to be spent on the generationof compact models. The simple analytic form of the interpolating splines can beexploited to evaluate the convolution integral of the Zth-functions witharbitrary power profiles at low computational costs. An implementation of thealgorithm in a spreadsheet program EXCEL is demonstrated. The results are invery good agreement with temperature profiles computed by transient FiniteElement simulation but can be obtained in a fraction of the time.



Author: D. Schweitzer

Source: https://arxiv.org/







Related documents