Reliability of metal-glass-ceramic junctions made by solid state bondingReport as inadecuate




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1 MAT - Centre des Matériaux

Abstract : The solid state diffusion bonding leads to helium-tight ceramic-metal junctions. However this technique induces residual stresses due to expansion mismatches which may cause ceramic flaws to propagate hence junction delayed failure. This phenomenon is evidenced on glass-ceramic-Al-Invar junctions from which a better reliability is ensured by a reduction of surface flaws.





Author: G. Lascar Daniel Broussaud - Alain Thorel - Georges Cailletaud - J. Roland

Source: https://hal.archives-ouvertes.fr/



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