Planar lightwave integrated circuits with embedded actives for board and substrate level optical signal distributionReport as inadecuate


Planar lightwave integrated circuits with embedded actives for board and substrate level optical signal distribution


Planar lightwave integrated circuits with embedded actives for board and substrate level optical signal distribution - Download this document for free, or read online. Document in PDF available to download.

As the data rate of integrated circuits dramaticallyincreases, interconnection speed at the backplane and board levelsare beginning to limit system performance, which drives investigationsinto alternative interconnection technologies. Criticalfactors to consider when evaluating alternative interconnectionapproaches include interconnect speed, power consumption,area, and compatibility with current backplane and boardintegration technologies. Optical interconnections can achievevery high speed with a significant reduction in interconnectfootprint compared to transmission lines, robust signal qualityin high-density interconnection systems because of immunity toelectromagnetic interference, and potentially simple to designcompared to transmission lines lines with materials whichcan be postprocessed onto printed wiring boards or integratedinto the board structure. This paper explores design options forplanar optical interconnections integrated onto boards, discussesfabrication options for both beam turning and embedded interconnectionsto optoelectronic devices, describes integrationprocesses for creating embedded planar optical interconnections,and discusses measurement results for a number of integrationschemes that have been demonstrated by the authors. In the areaof optical interconnections with beams coupled to and from theboard, the topics covered include integrated metal-coated polymermirrors and volume holographic gratings for optical beam turningperpendicular to the board. Optical interconnections that utilizeactive thin film approximately 1-5 µm thick optoelectroniccomponents embedded in the board are also discussed, using bothSi and high temperature FR-4 substrates. Both direct and evanescentcoupling of optical signals into and out of the waveguide arediscussed using embedded optical lasers and photodetectors.



COPE Publications -



Author: Jokerst, Nan M. - Gaylord, Thomas K. - Glytsis, E. - Brooke, Martin A. - Cho, S. - Nonaka, T. - Suzuki, T. - Geddis, Demetris L.

Source: https://smartech.gatech.edu/







Related documents