High-Performance Chip-to-Chip Communications Using Advanced Materials and StructuresReport as inadecuate


High-Performance Chip-to-Chip Communications Using Advanced Materials and Structures


High-Performance Chip-to-Chip Communications Using Advanced Materials and Structures - Download this document for free, or read online. Document in PDF available to download.

The -off-chip- bandwidth is a major bottleneck causing system delays and limited throughput, especially in areas such as processor-to-memory bandwidth and processor-to-network. The ITRS cites off-chip signal bandwidth exceeding 60 GHz within 10 years. Organic substrates i.e. chip packages or interposers with flip-chip solder connections are the core of the first and second level of interconnect. Off-chip bandwidth is limited to several GHz due to frequency dependent attenuation, signal reflections, and crosstalk within the polymer dielectric, via structures, and I-O signal path transitions within the chip substrate and mother board.In this work, we have introduced advances in off-chip interconnect using air-isolated, coaxial links on substrates and boards to demonstrate ultra high-speed chip-to-chip and chip-to-network communications. New approaches have been found to fabricating high frequency I-O, air-and isolated coaxial links on the substrate. The materials, processes and electrical characteristics will be presented.



Nano@Tech Lecture Series -



Author: Kohl, Paul A. - Spencer, Todd - Osborn, Tyler - -

Source: https://smartech.gatech.edu/







Related documents