Microstructure of Rehandled Layer on the Surface of Nano-CuCr AlloyReport as inadecuate




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Nano-CuCr25 and nano-CuCr50 alloys are prepared by vacuum hot pressing using powders activated by high energy ball-milling. The surface of the alloys after arc erosion and the rehandled layer are studied. The depth of the rehandled layer on nano-CuCr50 is found to be 3~6 micrometers at low current and the microstructure is refined. At high-current´╝îthe rehandled layer of nano-CuCr25 is found to be about 3~4 micrometers. Compared with normal CuCr25 alloy, nano-CuCr25 is more stable as cathode. Anode spots which can destroy the contact occur at high-current. Arc energy of nano-CuCr25 is lower than that of normal CuCr25 alloy.

KEYWORDS

nano-CuCr alloys; rehandled layer; microstructure; vacuum arc energy

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Author: Jia Cheng, Heng Zhang, Zhi-mao Yang, Bing-jun Ding

Source: http://www.scirp.org/



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