Investigation into Mass Loading Sensitivity of Sezawa Wave Mode-Based Surface Acoustic Wave SensorsReport as inadecuate




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1

Electrical and Computer Systems Engineering, School of Engineering, Monash University Sunway Campus, Jalan Lagoon Selatan, Bandar Sunway 46150, Malaysia

2

Institute of Microengineering and Nanoelectronics IMEN, Universiti Kebangsaan Malaysia UKM, Bangi 43600, Malaysia

3

Department of Electrical Engineering, Electronics & Systems, Faculty of Engineering & Built Environment, Universiti Kebangsaan Malaysia UKM, Bangi 43600, Malaysia





*

Author to whom correspondence should be addressed.



Abstract In this work mass loading sensitivity of a Sezawa wave mode based surface acoustic wave SAW device is investigated through finite element method FEM simulation and the prospects of these devices to function as highly sensitive SAW sensors is reported. A ZnO-Si layered SAW resonator is considered for the simulation study. Initially the occurrence of Sezawa wave mode and displacement amplitude of the Rayleigh and Sezawa wave mode is studied for lower ZnO film thickness. Further, a thin film made of an arbitrary material is coated over the ZnO surface and the resonance frequency shift caused by mass loading of the film is estimated. It was observed that Sezawa wave mode shows significant sensitivity to change in mass loading and has higher sensitivity eight times higher than Rayleigh wave mode for the same device configuration. Further, the mass loading sensitivity was observed to be greater for a low ZnO film thickness to wavelength ratio. Accordingly, highly sensitive SAW sensors can be developed by coating a sensing medium over a layered SAW device and operating at Sezawa mode resonance frequency. The sensitivity can be increased by tuning the ZnO film thickness to wavelength ratio. View Full-Text

Keywords: surface acoustic wave devices; Sezawa wave mode; mass loading effect; sensors; FEM simulation surface acoustic wave devices; Sezawa wave mode; mass loading effect; sensors; FEM simulation





Author: Ajay Achath Mohanan 1, Md Shabiul Islam 2, Sawal Hamid Md Ali 3, R. Parthiban 1 and N. Ramakrishnan 1,*

Source: http://mdpi.com/



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