An Efficient, Versatile, and Safe Access to Supported Metallic Nanoparticles on Porous Silicon with Ionic LiquidsReport as inadecuate




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1

CNRS-Université de Lyon-ESCPE Lyon, UMR 5265 C2P2, 43 Bd du 11 Novembre 1918, Villeurbanne 69616, France

2

CEA, LETI, MINATEC Campus, Grenoble 38054, France

3

Université Grenoble Alpes, Grenoble 38000, France





*

Author to whom correspondence should be addressed.



Academic Editors: Andreas Taubert and Peter Hesemann

Abstract The metallization of porous silicon PSi is generally realized through physical vapor deposition PVD or electrochemical processes using aqueous solutions. The former uses a strong vacuum and does not allow for a conformal deposition into the pores. In the latter, the water used as solvent causes oxidation of the silicon during the reduction of the salt precursors. Moreover, as PSi is hydrophobic, the metal penetration into the pores is restricted to the near-surface region. Using a solution of organometallic OM precursors in ionic liquid IL, we have developed an easy and efficient way to fully metallize the pores throughout the several-µm-thick porous Si. This process affords supported metallic nanoparticles characterized by a narrow size distribution. This process is demonstrated for different metals Pt, Pd, Cu, and Ru and can probably be extended to other metals. Moreover, as no reducing agent is necessary the decomposition in an argon atmosphere at 50 °C is fostered by surface silicon hydride groups borne by PSi, the safety and the cost of the process are improved. View Full-Text

Keywords: porous silicon; metallization; surface reactivity; metallic nanoparticles porous silicon; metallization; surface reactivity; metallic nanoparticles





Author: Walid Darwich 1, Paul-Henri Haumesser 2,3,* , Catherine C. Santini 1 and Frédéric Gaillard 2,3

Source: http://mdpi.com/



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