Finite Element Modeling of Stress Evolution in Sn Films due to Growth of the Cu6Sn5 Intermetallic CompoundReport as inadecuate




Finite Element Modeling of Stress Evolution in Sn Films due to Growth of the Cu6Sn5 Intermetallic Compound - Download this document for free, or read online. Document in PDF available to download.

Journal of Electronic Materials

, 38:2676

First Online: 12 August 2009Received: 16 March 2009Accepted: 23 July 2009

Abstract

We use finite element simulations to quantitatively evaluate different mechanisms for the generation of stress in Sn films due to growth of the Cu6Sn5 intermetallic phase at the Cu-Sn interface. We find that elastic and plastic behavior alone are not sufficient to reproduce the experimentally measured stress evolution. However, when grain boundary diffusion is included, the model results agree well with experimental observations. Examination of conditions necessary to produce the observed stresses provides insight into potential strategies for minimizing stress generation and thus mitigating Sn whisker growth.

KeywordsPb-free solder Sn whisker finite element grain boundary diffusion  Download to read the full article text



Author: Eric Buchovecky - Nitin Jadhav - Allan F. Bower - Eric Chason

Source: https://link.springer.com/







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