A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer PackagesReport as inadecuate




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International Journal of Antennas and Propagation - Volume 2016 2016, Article ID 9562854, 8 pages -

Research ArticleSchool of Physical Electronics, University of Electronic Science and Technology of China, No. 4, Section 2, North Jianshe Road, Chengdu 610054, China

Received 1 December 2015; Revised 2 February 2016; Accepted 21 February 2016

Academic Editor: Diego Masotti

Copyright © 2016 M. X. Yu. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

This paper investigates a novel X-band microstrip-to-microstrip vertical via transition with matching pads loaded signal via. This design has been proposed for a multilayer substrate package. The matching pads, which are located in the center of the signal via on each ground layer, are adopted to further improve the impedance matching level and thus attain better signal transition performance. A physics-based equivalent circuit modeling approach has been employed for this research. The right angle MS-to-MS via transition was also designed using this technique. The simulated -parameters indicate that the match-pad design made a breakthrough in achieving an approximate −15 dB wide-band return loss reduction. The measured -parameter of MS-to-MS transition showed that return loss with the matching pads is better than that without the matching pads.





Author: M. X. Yu

Source: https://www.hindawi.com/



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