A CFD Analysis of an electronics cooling enclosure for application in telecommunication systemsReport as inadecuate




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* Corresponding author 1 UON - University of Nottingham, UK 2 Nuventix Inc.

Abstract : This paper presents results of CFD analysis of an electronics cooling enclosure used as part of a larger telecommunication radar system. An original cooling enclosure was simulated using Flotherm which results were taken as the benchmark thermal performance. It was found that the operating temperature of one of the Radio Frequency RF components will exceed the design temperature limit of the PCB. A solution involving a re-design of thermal spreading arrangements using a 3mm thick copper shelf and a Vapour Chamber VC heat pipe was found to bring the operating temperatures of all RF components within the specified temperature limits. The use of a VC, in particular, reduced the 60W RF component steady state temperature by an average of 5.4°C. The study also shows that increasing the finned heat exchanger cooling air flow rate can lower further the RF components temperature though at the expense of increasing energy consumption of the fan.

Keywords : Electronics cooling CFD Flotherm RF components heat spreader





Author: R. Boukhanouf - A. Haddad -

Source: https://hal.archives-ouvertes.fr/



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