Ultra-thin BCB bonding for heterogeneous integration of III-V devices and SOI photonic componentsReport as inadecuate




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(2005)12th European Conference on Integrated Optics (ECIO'05).p.250-253 Mark

Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-327054



Author: G√ľnther Roelkens , Dries Van Thourhout , Ilse Christiaens , Roel Baets and Meint Smit

Source: https://biblio.ugent.be/publication/327054



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