EMC-signatures of microcontrollers under thermal stress analyzed by FSVReport as inadecuate




EMC-signatures of microcontrollers under thermal stress analyzed by FSV - Download this document for free, or read online. Document in PDF available to download.

(2011)8th international workshop on electromagnetic compatibility of integrated circuits, Proceedings. Mark abstract The EMC-signature of devices containing microcontrollers can differ due to thermal or mechanical stress. Research is presented to prove the feature selective validation method (FSV) to be sensitive enough to analyze differences in signatures.

Please use this url to cite or link to this publication: http://hdl.handle.net/1854/LU-1905269



Author: Jos Knockaert , Mohamed Malki, David Baudry, Mohamed Ramdani and Davy Pissoort

Source: https://biblio.ugent.be/publication/1905269



DOWNLOAD PDF




Related documents