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Frontiers of Mechanical Engineering

pp 1–10

First Online: 27 July 2017Received: 17 November 2016Accepted: 20 March 2017

Abstract

This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set at the center to detect the Z-axis component of an electrostatic field. Two pairs of sensing elements with the same structure are arranged in a cross-like configuration to measure the X- and Y-axis electrostatic field components. An in-plane rotary mechanism is used in the microsensor to detect the X-, Y-, and Z-axis electrostatic field components simultaneously. The proposed microsensor is compact and presents high integration. The microsensor is fabricated through a MetalMUMPS process. Experimental results show that in the range of 0–50 kV-m, the linearity errors of the microsensor are within 5.5%, and the total measurement errors of the three electrostatic field components are less than 14.04%.

Keywordselectric field microsensor three-dimensional single-chip in-plane rotation This article is published with open access at link.springer.com and journal.hep.com.cn

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Author: Biyun Ling - Yu Wang - Chunrong Peng - Bing Li - Zhaozhi Chu - Bin Li - Shanhong Xia

Source: https://link.springer.com/



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